Appendix D - Specifications of the QED Board and Product Design Kit

This appendix summarizes the hardware and mechanical specifications of the QED Board and the QED Product Design Kit. It also offers suggestions about methods for mating the QED Board to your application-specific printed circuit board.

The hardware specifications for the MC68HC11F1 68HC11 processor and QED Board single board computer are summarized here:

OEM users typically design a system containing the QED Board plus one custom printed circuit board. These boards can of course be joined by ribbon cables using the standard QED shrouded male headers. Another approach for volume OEM customers is to ask Mosaic Industries to mount the connectors on the processor side of the board. Your application-specific board can then be fabricated with female connectors located to mate with the male connectors on the QED Board. This allows the two boards to be disconnected at any time, and allows the memory components and onboard DIP switches to be manipulated without separating the QED Board from the application-specific board.

The most reliable way to mate the QED Board with a custom board is to directly solder them. Volume OEM customers can make arrangements with Mosaic Industries to have the QED boards fabricated with unshrouded male connectors on the processor side of the board. These can be soldered into mating holes on your custom application-specific circuit board. Memory components, serial and power connectors, and DIP switches remain accessible without separating the two boards. This method offers the greatest degree of mechanical rigidity and is appropriate in applications where the two boards do not have to be separated after the time of manufacture.